ibrahim abe m elfadel
3D Stacked Chips
EbookSofort lieferbar.Describes techniques for monitoring and mitigating thermal behavior in 3D ICs;
The IoT Physical Layer
EbookSofort lieferbarThis book documents some of the most recent advances on the physical layer of the Internet of Thi...
Machine Learning in VLSI Computer-Aided Design
EbookSofort lieferbarThis book provides readers with an up-to-date account of the use of machine learning frameworks, ...
VLSI-SoC: Opportunities and Challenges Beyond the Internet of Things
EbookSofort lieferbarThis book contains extended and revised versions of the best papers presented at the 25th IFIP WG...
Secure, Low-Power IoT Communication Using Edge-Coded Signaling
EbookSofort lieferbarThis book discusses single-channel, device-to-device communication in the Internet of Things (IoT...
VLSI-SoC 2023: Innovations for Trustworthy Artificial Intelligence
EbookSofort lieferbarThis book contains revised and extended versions of a selection of papers presented at the 31st I...
Machine Learning in VLSI Computer-Aided Design
BuchBezug 11-15This book provides readers with an up-to-date account of the use of machine learning framework...
3D Stacked Chips
BuchBezug 11-15This book explains for readers how 3D chip stacks promise to increase the level of on-chip integr...
The IoT Physical Layer
BuchBezug 11-15This book documents some of the most recent advances on the physical layer of the Internet of Thi...
3D Stacked Chips
TaschenbuchBezug 11-15This book explains for readers how 3D chip stacks promise to increase the level of on-chip integr...
The IoT Physical Layer
TaschenbuchBezug 11-15This book documents some of the most recent advances on the physical layer of the Internet of ...
VLSI-SoC: Opportunities and Challenges Beyond the Internet of Things
TaschenbuchBezug 11-15This book contains extended and revised versions of the best papers presented at the 25th IFIP WG...
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