Provides a comprehensive overview of the challenges in ultra-thin chip fabrication, post processing, properties and applications by leaders in the field sharing their newest results and ideas;Compares strengths and weaknesses of three leading, generic fabrication processes for ultra-thin chips;
Describes electronic, mechanical, optical, and thermal properties of ultra-thin chips that are different from those of conventional, thick chips
Fabrication technologies for ultra-thin chips.-Post-processing techniques and issues.-Properties of ultra-thin chips; Applications.
Ultra-thin chips are the "smart skin" of a conventional silicon chip. This book shows how very thin and flexible chips can be fabricated and used in many new applications in microelectronics, Microsystems, biomedical and other fields. It provides a comprehensive reference to the fabrication technology, post processing, characterization and the applications of ultra-thin chips.